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Huizhou Liandajin Electronic Co., Ltd
HomeProductsPCB ManufactureHDI PCBFR4 HDI PCB ENIG Multilayers HDI Circuit Board
  • FR4 HDI PCB ENIG Multilayers HDI Circuit Board
  • FR4 HDI PCB ENIG Multilayers HDI Circuit Board
  • FR4 HDI PCB ENIG Multilayers HDI Circuit Board
  • FR4 HDI PCB ENIG Multilayers HDI Circuit Board
  • FR4 HDI PCB ENIG Multilayers HDI Circuit Board
  • FR4 HDI PCB ENIG Multilayers HDI Circuit Board

FR4 HDI PCB ENIG Multilayers HDI Circuit Board

  • $0.04
    ≥1
    Piece/Pieces
  • Product Description
Overview
Product Attributes

Model No.LDJPCB-I0923

BrandLDJ

Place Of OriginChina

Base MaterialFR4

Board Thickness0.2mm-6mm

Layer1-20 layers

Copper Thickness1/3oz-6oz

Surface FinishHASL/LF,OSP,Immersion Gold,Immersion Tin,Immersion Silver

Solder MaskGreen,Blue,Black,White,Red etc

Min. Hole Size0.1mm

Min. Line Width0.15mm

Min. Line Spacing0.15mm

Hole TolerancePTH: ±0.075, NTPH: ±0.0

Supply Ability & Additional Information

PackagingBlister vacuum packaging,carton box

Productivity60000 square meters per month

TransportationOcean,Land,Air,Express

Place of OriginChina

Supply Ability60000 square meters per month

Certificaterohs

Portshenzhen,hongkong,guangdong

Payment TypeT/T,Paypal,Western Union,L/C

IncotermFOB,EXW,Express Delivery,DDU,CFR,CIF,FCA,CIP

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
Blister vacuum packaging,carton box
Picture Example:
Buried hole: Buried hole, the connection of any circuit layer inside the PCB but not conducted to the outer layer. This process cannot be achieved by drilling after bonding. Drilling must be performed on individual circuit layers. First, the inner layer must be partially bonded and then electroplated. Finally, all bonding can be performed. Compared with the original "through hole" and "Blind hole" is more labor-intensive, so the price is also the most expensive. This process is usually...

Product Categories : PCB Manufacture > HDI PCB

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