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Huizhou Liandajin Electronic Co., Ltd
HomeProductsPCB ManufactureHDI PCBHDI PCB 2+n+2 Produce Process
  • Product Description
Overview
Product Attributes

Model No.LDJPCB_J8934

Place Of OriginChina

Base MaterialFR4

Copper Thickness1/3oz-6oz

Board Thickness0.2mm-6mm

Surface FinishHASL/LF,OSP,Immersion Gold,Immersion Tin,Immersion Silver

Solder MaskGreen,Blue,Black,White,Red etc

Layer1-20 layers

Min. Line Spacing0.075mm

Min. Line Width0.075mm

Min. Hole Size0.1mm

Hole TolerancePTH: ±0.075, NTPH: ±0.0

Supply Ability & Additional Information

PackagingPCB:vacuum package,prevent moisture and oxidation

Productivity60000 square meters per month

TransportationOcean,Land,Air,Express

Place of OriginChina

Supply Ability60000 square meters per month

CertificateRoHs,ISO9001

Portshenzhen,guangzhou

Payment TypeL/C,Paypal,T/T,Western Union,Credit Card

IncotermFOB,CFR,CIF,EXW,FCA,CIP,DDU

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
PCB:vacuum package,prevent moisture and oxidation
Picture Example:
Product Description HDI PCB 2+n+2 Produce Process.HDI PCB application: high-speed industrial system applications.HDI Circuit Board stack-up structure diagram. Process flow chart of HDI and high precision multilayer board: PCB Basic Specifications Brand LDJ Type BMS PCB Material FR4(High TG,Standard TG and Teflon TG) /CEM3 / Ceramic / Aluminum /High Frequency Plate / Teflon plate etc. Number of layer 1-20 layers (include Rigid PCB,Flexible PCB and...

Product Categories : PCB Manufacture > HDI PCB

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HomeProductsPCB ManufactureHDI PCBHDI PCB 2+n+2 Produce Process
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