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Home> Industry Information> STMicroelectronics Releases Economical Radiation Hardened Chips for Cost-conscious "New Space" Satellite Applications

STMicroelectronics Releases Economical Radiation Hardened Chips for Cost-conscious "New Space" Satellite Applications

June 21, 2022

New radiation-hardened Chip from STMicroelectronics helps low-orbit satellites expand communications coverage and Earth observation services

March 24, 2022, China – STMicroelectronics (ST; NYSE: STM), the world's leading semiconductor company serving multiple electronic applications, simplifies a new generation of small low-earth orbits (low-earth orbits, LEO for short) satellite design and mass production. Affordable and reliable low-orbit (LEO) satellites can provide services such as Earth observation and broadband internet from low-Earth orbit.


ST's new family of radiation-hardened power, analog and logic chips in low-cost plastic packages provide important functions for satellite electronic circuits. STMicroelectronics has just released the first nine products in the family, which includes a data converter, a voltage regulator, an LVDS transceiver, a line driver, and five logic gates for use in entire satellite systems such as , power generation and distribution, on-board computers, satellite remote sensing trackers, transceivers and other satellite systems. ST will continue to release new products in the coming months, expanding the family and adding more features to further expand the designer's choice.

"We are in a new era of commercialization and democratization of space, often referred to as the new space, that fundamentally changes the economics of satellite design, manufacturing, launch and operations," said Marcello San Biagio, general manager of STMicroelectronics' General Purpose and RF Products Division. .These previously low-volume, purpose-built spacecraft are rapidly being commoditized, distributed in large constellations that sometimes contain thousands of cells. ST has supported the aerospace industry for decades and has accumulated a wealth of expertise, combined in The technical expertise in commercial IC manufacturing enables the new family of products to be priced competitively while still being robust enough to meet the challenges of the LEO environment, especially radiation hardened requirements."

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