Product Categories
(Total 12 Products for 6layers Pcb Board)
6Layers Circuit Board Fabrication Service Auto Control PCB
Product Description 6Layers Circuit Board Fabrication Service Auto Control PCB No MOQ 24 hours quick turn prototype 100% Electrical test guarantee PCB Basic Specifications Brand LDJ Type
6Layers Circuit Board Assembly Electronic Board Prototype
Product Description 6Layers Circuit Board Assembly Electronic Board Prototype. Various sizes like 1206, 0805, 0603 components .SMT technology.Nitrogen gas reflow soldering technology for SMT.High standard SMT and solder assembly line
PCBA Business： --Lead time:7-dyays for sample 10-21 days for big Batch PCB Basic...
Printed Circuit Board 6Layers PCB Fabrication Assembly
Founded in 2005,LDJ has 16-years production experience in printed circuit board,includes the rigid PCB,flexible PCB and rigid-flexible PCB,professional circuit board manufacturer in China,factory covers 20000 square meters,LDJ finds its long-time service in Consumer Electronics,Telecommunication Equipment,automotive...
Designed Circuit Board PCB One Stop Solutioner
How to Manufacture PCB?The PCB Production Process is very complex,there are many manufacturing processes and manufactured equipment.Take the simple 2layers PCB for example: Material Cutting: Cut the production work size according to the engineer design substrate specifications and layout drawings. Drilling: Drilling...
Shenzhen Custom Printed Circuit Board Electronic PCBA EMS
There are several treatment processes for the surface of the circuit board: light board (no treatment on the surface),rosin board, OSP (organic solder protectant, slightly better than rosin),tin spray (with lead tin, lead-free tin),gold-plated board,ENIG surface finished, Shen Jinban, etc., these are more perceptible....
Multilayers Rigid Flex PCBA Assembly Rigid-flex Board SMT
Product Description Multilayers Rigid Flex PCBA Assembly Rigid-flex Board SMT. Professional surface-mounting and through-hole soldering technology.Various sizes like 1206, 0805, 0603 components SMT technology. PCBA Business： --Lead time:7-dyays for sample 10-21 days for big Batch PCB Basic Specifications Brand
1.6mm Rigid PCB Fabrication Double Sided Circuit Board
Product Description Rigid PCB Board Fabrication Double Sided Circuit Board We are a solutioner for high precision PCB and PCBA,and serve the designing,researching and developing,producing and selling for PCBs. PCB Business： -Capacity：60000m2 -Employees:1000 -Monthly Output:20000M2 -Capability:1-20L PCB Basic...
Rigid PCBA Assembly Service Rigid Circuit Board Assembly
Product Description Rigid PCBA Assembly Service Rigid Circuit Board Assembly. Professional surface-mounting and through-hole soldering technology.Various sizes like 1206, 0805, 0603 components SMT technology. PCBA Business： --Lead time:7-dyays for sample 10-21 days for big Batch PCB Basic Specifications Brand
Double Sided Board OEM PCBA SMT Assembly Service
Product Description Double Sided PCBA Baord OEM PCBA SMT Assembly Service. ICT (In Circuit Test), FCT (Functional Circuit Test) technology.PCB assembly with UL, CE, FCC, RoHS approval. PCBA Business： --Lead time:7-dyays for sample 10-21 days for big Batch PCB Basic Specifications Brand
RoHs PCB Board assembly Medical PCBA Board Assembly
Product Description RoHs PCB Board assembly Medical PCBA Board Assembly. ICT (In Circuit Test), FCT (Functional Circuit Test) technology.PCB assembly with UL, CE, FCC, RoHS approval. PCBA Business： --Lead time:7-dyays for sample 10-21 days for big Batch PCB Basic Specifications Brand LDJ Type BMS PCB Material
ENIG Circuit Board Gerber Design Rigid-flex PCB Design
Product Description ENIG Circuit Board Gerber Design Rigid-flex PCB Design.Whether it's the perfect layout of a new design, redesign of existing PCBs and/or circuits, PCB delivery, component sourcing for existing or new projects, or overseeing draft plans up to and including the assembled final product, you can rest...
FR4 HDI PCB ENIG Multilayers HDI Circuit Board
Buried hole: Buried hole, the connection of any circuit layer inside the PCB but not conducted to the outer layer. This process cannot be achieved by drilling after bonding. Drilling must be performed on individual circuit layers. First, the inner layer must be partially bonded and then electroplated. Finally, all...
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